The main objective of the international business symposium on “Assembling and soldering of printed circuit assemblies of electronic equipment. Surface mount technology” was to educate local electronic industry enterprises in the field of surface mount technology development in CIS countries and abroad.
Our first business symposium was attended by more than 70 leading Russian and foreign companies – manufacturers of electronics, components and equipment.
According to reviews, this symposium was a breakthrough in the information vacuum in the field of surface mount technology. This interest in the symposium allowed making this significant event an annual one. Hundreds of Russian and dozens of foreign enterprises have participated in international Asold symposiums during a three-year period (1992 to 1994).